JPS5989494A - プリント配線板用多層銅張積層板の製造法 - Google Patents
プリント配線板用多層銅張積層板の製造法Info
- Publication number
- JPS5989494A JPS5989494A JP19992082A JP19992082A JPS5989494A JP S5989494 A JPS5989494 A JP S5989494A JP 19992082 A JP19992082 A JP 19992082A JP 19992082 A JP19992082 A JP 19992082A JP S5989494 A JPS5989494 A JP S5989494A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- copper foil
- inner layer
- continuously
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 title 1
- 239000000463 material Substances 0.000 claims description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 47
- 239000011889 copper foil Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000002966 varnish Substances 0.000 claims description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical class [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19992082A JPS5989494A (ja) | 1982-11-15 | 1982-11-15 | プリント配線板用多層銅張積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19992082A JPS5989494A (ja) | 1982-11-15 | 1982-11-15 | プリント配線板用多層銅張積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5989494A true JPS5989494A (ja) | 1984-05-23 |
| JPH0320917B2 JPH0320917B2 (en]) | 1991-03-20 |
Family
ID=16415793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19992082A Granted JPS5989494A (ja) | 1982-11-15 | 1982-11-15 | プリント配線板用多層銅張積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5989494A (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310593A (ja) * | 1986-07-02 | 1988-01-18 | 松下電工株式会社 | 多層プリント配線基板の製造方法 |
| JPS63285997A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Electric Corp | 多層基板の製造方法および装置 |
| JPS63285998A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Electric Corp | 多層基板の製造方法および装置 |
-
1982
- 1982-11-15 JP JP19992082A patent/JPS5989494A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310593A (ja) * | 1986-07-02 | 1988-01-18 | 松下電工株式会社 | 多層プリント配線基板の製造方法 |
| JPS63285997A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Electric Corp | 多層基板の製造方法および装置 |
| JPS63285998A (ja) * | 1987-05-18 | 1988-11-22 | Mitsubishi Electric Corp | 多層基板の製造方法および装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0320917B2 (en]) | 1991-03-20 |
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